Power generation and compound manufacturing capacity expected to hit record 10 million wafers per month in 2023, SEMI reports show


China is expected to claim the largest share of installed capacity – 33% – by 2023, followed by Japan at 17%, Europe and the Middle East at 16%, and Taiwan at 11%, proportions that should change little as the industry remains on track to add more than 360,000 WPM in 2024.

SEMI Fab Power & Compound report until 2024 reveals that 63 companies are expected to add more than 2 million WPM (in 200mm equivalent) from 2021 to 2024. Infineon, Hua Hong Semiconductor, STMicroelectronics and Silan Microelectronics will lead the way, together adding 700,000 WPM planned.

The installed capacity of the power industry and component manufacturing plants grew 5% year-on-year (YOY) in 2019 and 3% in 2020 before jumping 7% in 2021. The growth on the year-on-year basis annual growth is expected to remain strong at 6% in 2022 and 5% in 2023 as the industry surpasses the 10 million WPM mark.

Industry is also adding production facilities. From 2021 to 2024, 47 high-probability facilities and lines (high-volume R&D, including epitaxial wafers) are expected to come online to bring the industry total to 755, a number that could be eclipsed if new facilities and lines are advertised.

SEMI Fab Power & Compound report until 2024 covers 957 installations and lines operational over the 12 years from 2013 to 2024, including installations that are or will be closed, and new installations in operation.

For more information on the report or to download sample data, please visit Fab Power & Compound report until 2024.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance electronic technology and design and manufacturing activities. SEMI members are responsible for innovations in materials, design, equipment, software, devices and services that enable smarter, faster, more powerful and more affordable electronics. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are partners of the SEMI strategic association, communities defined within SEMI focused on specific technologies . Visit www.semi.org to find out more, contact one of our offices around the world and connect with SEMI on LinkedIn and Twitter.

Associative contacts

Michel hall/SEMI
Phone: 1.408.943.7988
E-mail: [email protected]

Christian G. Dieseldorff/SEMI
Phone: 1.408.943.7940
E-mail: [email protected]


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