Global radiation-hardened electronics market to reach $1.6 billion by 2027 growing at a CAGR of 3%


DUBLIN, September 5, 2022 /PRNewswire/ — The “Radiation Hardened Electronics Market: Global Industry Trends, Share, Size, Growth, Opportunities and Forecast 2022-2027” report has been added to from offer.

The global radiation hardened electronics market reached a value of US$1.3 billion in 2021. Looking ahead, the publisher expects the market to reach US$1.6 billion by 2027, presenting a CAGR by 3% over the period 2022-2027. Keeping in mind the uncertainties of COVID-19, we continuously monitor and assess the direct and indirect influence of the pandemic on different end-use sectors. This information is included in the report as a major market contributor.

Radiation hardened electronics refers to various electronic components, housings and products that are primarily used for high altitude applications. Materials used to manufacture such components include silicon, silicon carbide, gallium nitride, and hydrogenated amorphous silicon.

These components resist damage from ionizing and high-energy radiation, and gamma and neutron radiation emitted by nuclear reactors. They are widely used in satellites, aircraft and nuclear power plants in the form of switching regulators, microprocessors and power devices. For this reason, they find many applications in various industries including aviation, space, military and defense.

The global market is mainly driven by the growing number of space missions and exploration activities. In this light, the growing demand for communications satellites for Intelligence, Surveillance and Reconnaissance (ISR) operations is also driving the growth of the market. Radiation-hardened electronics are crucial in protecting electronic equipment from physical damage and failure caused by harmful radiation in space.

Also, the widespread adoption of the products for manufacturing power management devices is creating a positive impact in the market. These electronic components are also used to manufacture diodes, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs) for various military and defense applications.

Moreover, various technological advancements such as the development of highly reliable integrated circuits and improvements in field-programmable gate array (FPGA) technology are creating a positive outlook for the market. Other factors including significant growth in the electronics industry and extensive research and development (R&D) activities are expected to further boost the market.

Key Market Segmentation:

The publisher provides analysis of key trends in each sub-segment of the global radiation hardened electronics market, as well as forecasts at the global, regional and country levels from 2022 to 2027. Our report has categorized the market based on type of product, type of material, technique, type of component and application.

Breakdown by product type:

  • Custom made
  • Off-the-shelf commercial

Breakdown by type of material:

  • Silicon
  • Silicon carbide
  • Gallium Nitride
  • Others

Break by technique:

  • Radiation hardening by design (RHBD)
  • Radiation hardening by process (RHBP)
  • Radiation hardening by software (RHBS)

Breakdown by type of component:

  • Power Management
  • Application specific integrated circuit
  • Logic
  • Memory
  • Field Programmable Gate Array
  • Others

Breakdown by application:

  • space satellites
  • commercial satellites
  • Military
  • Aeronautics and Defense
  • Nuclear center
  • Others

Breakdown by region:

  • North America
  • United States
  • Canada
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Indonesia
  • Others
  • Europe
  • Germany
  • France
  • UK
  • Italy
  • Spain
  • Russia
  • Others
  • Latin America
  • Brazil
  • Mexico
  • Others
  • Middle East and Africa

Main topics covered:

1 Preface

2 Scope and methodology

3 Executive Summary

4 Presentation

5 Global Radiation Hardened Electronics Market

6 Market Breakdown by Product Type

7 Market Breakdown by Material Type

8 Market Breakdown by Technique

9 Market Breakdown by Component Type

10 Market Breakdown by Application

11 Market Breakdown by Region

12 SWOT Analysis

13 Value chain analysis

14 Analysis of the five forces of carriers

15 price indicators

16 Competitive Landscape

Companies cited

  • Analog Devices Inc.
  • BAE Systems plc
  • Cobham Plc (Advent International)
  • Data Device Corporation (Transdigm Group Incorporated)
  • Honeywell International Inc.
  • Microchip Technology Inc.
  • STMicroelectronics
  • Texas Instruments Incorporated
  • The Boeing Company
  • Xilinx Inc.

For more information on this report, visit

Media Contact:

Research and Markets
Laura Woodsenior
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SOURCE Research and Markets

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